Curable hot melt adhesive for casemaking
US6858695B2 · kind B2 · utility
9Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2001 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | May 4, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A curable casemaking adhesive, books and related articles bound thereby. In one embodiment, a UV curable hot melt adhesive is used to form the case, which is preferably also embossed. In another embodiment, a moisture curable hot melt adhesive is used to form the case, which is preferably also embossed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.