Radiation shielding of three dimensional multi-chip modules
US6858795B2 · kind B2 · utility
8Cited by
70References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2003 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | Aug 18, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.