Patent · US Expired

Substrate for receiving a circuit configuration and method for producing the substrate

US6858807B2 · kind B2 · utility

2Cited by

6References

22Claims

0Family size

Assignee

EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH · DE

Inventors

Gottfried Ferber · Warstein, DE
Reimund Pelmer · Soest, DE

Key dates

Filing date	Dec 2, 2002
Grant date	Feb 22, 2005
Priority date	—
Expiry date	Dec 18, 2022

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49155
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A substrate is adapted to accommodate a circuit configuration. The novel substrate is stable under alternating loads and it favorably dissipates heat. To this end, the substrate has a fastening zone to be connected to a contact element that is to be provided. The fastening zone is fixed on the carrier substrate with a first section. A second section projects from the plane of the carrier substrate, and the first and the second sections are adapted to be electrically and mechanically connected to the contact element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.