Simulating euclidean wiring directions using manhattan and diagonal directional wires
US6858935B1 · kind B1 · utility
12Cited by
34References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2002 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | Jan 11, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit has a metal layer that includes conductors to provide interconnectivity for components of the integrated circuit chip. The metal layer is divided into at least two sections, such that a first section has a preferred direction and the second section has a preferred wiring direction that is different from the first preferred direction. The first and second preferred directions on a single metal layer may consist of any direction. The metal layer may be divided into more than two sections, wherein each section has a preferred wiring direction. Wiring geometries for multi-level metal layers are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.