Methods and apparatuses for bonding in athermal optical fiber packages

US6859584B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Alan Johnson · Eugene, US
• Frank D. Braun · San Jose, US
• Edward P. Donlon · San Jose, US

Key dates

• Filing date: Dec 31, 2002
• Grant date: Feb 22, 2005
• Expiry date: Dec 31, 2022

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/0218
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An athermal package for fiber photonic devices includes a ferrule to attach the optical fiber to the package. The ferrule has an opening to receive the optical fiber. The ferule is collapsed to attach the optical fiber to the athermal package. Alternatively, the athermal package uses adhesive bonds disposed in pockets of the package. The pockets have a narrow end and a wide end, with the narrow ends facing each other. The adhesive bonds are disposed in the pockets in contact the narrow ends of the pockets but not with the wide ends. The narrow ends physically confine the adhesive bonds so that if the bonds expand or contract due to environmental conditions (or the curing process), the adhesive either expands or contracts near the wide ends of the pockets. This allows the strain on the optical fiber segment between the bonds to remain substantially constant.