Patent · US Expired

Method for fabrication of vertically coupled integrated optical structures

US6859603B2 · kind B2 · utility

3Cited by
5References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 5, 2001
Grant dateFeb 22, 2005
Priority date
Expiry dateMay 11, 2021

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02B2006/12176
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A manufacturing process is provided for fabrication of vertically coupled integrated photonic devices by projection lithographic technique. A multi-layered structure is formed which includes a pair of core waveguiding layers separated by a coupling interlayer and sandwiched between cladding layers. Prior to forming optical features in the core layers, alignment marks are etched completely through the whole multi-layered structure with the alignment marks being visible on both sides of the multi-layered structure to a conventional projection stepper. After the alignment marks are formed, a “bottom level” optical features are made through the bottom cladding layer, bottom core layer, and portion of intervening coupling layer. The formed sample is then bonded by a polymer to a carrier and a “top level” optical features are defined through the top cladding, top core layer, and portion of the intervening coupling layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.