Method for providing a matrix array ultrasonic transducer with an integrated interconnection means
US6859984B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2002 |
| Grant date | Mar 1, 2005 |
| Priority date | — |
| Expiry date | Nov 14, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53265
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method is provided for producing a matrix array ultrasonic transducer having an integrated interconnection assembly. A piezoelectric member, formed by a plurality of individual elemental transducers arranged in M×N matrix configuration, is provided and an interconnect interface device is joined to the rear face of the piezoelectric member. A plurality of printed circuits are then attached to the interconnect device so as to enable the resultant transducer array to be electrically connected to an external cable. The interconnect device is formed by an insulator member having dimensions in accordance with those of the piezoelectric member. A drilling operation is performed on the insulator member to form a corresponding array of through holes. The insulator member is then metallized and a resin used to provide filling of the through holes. Grooves are formed in at least one face of the insulator for receiving the printed circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.