I-channel surface-mount connector
US6860003B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 2, 2002 |
| Grant date | Mar 1, 2005 |
| Priority date | — |
| Expiry date | May 15, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49211
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In accordance with the invention, a low impedance surface-mount connector comprises a length of cylindrical rod having an I-shaped cross section. The device permits interconnection by pick-and-place techniques, and the interconnection has advantageous qualities of low resistance, low inductance, mechanical compliance and ease of manufacture. A first circuit device having one or more circuit components is interconnected with a second circuit device by surface mounting such connectors on the first circuit device, providing corresponding solder pads on the second circuit device, and mounting the connectors of the first circuit device onto the pads of the second.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.