LED module and methods for producing and using the module

US6860621B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Bernhard Bachl · Regensburg, DE
• Günter Kirchberger · Sinzing, DE
• Franz Schellhorn · Regensburg, DE
• Martin Weigert · Lindlar, DE

Key dates

• Filing date: Jan 10, 2003
• Grant date: Mar 1, 2005
• Expiry date: Jan 10, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/857
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An LED module includes a substrate having good thermal conductivity and one or more radiation-emitting semiconductor components that fixed on the top side of the substrate. The underside of the substrate is fixed on a carrier body having a high thermal capacity, in which the component fixing between the semiconductor components and the substrate and the substrate fixing between the substrate and the carrier body are embodied with good thermal conductivity. Furthermore, the invention relates to a method for producing the LED module, in which metal areas that are suitable as an etching mask improve the impressing of the current required during the anodic bonding, and at the same time, are used as contact areas for contact-connecting the radiation-emitting semiconductor components. The LED module has the advantage that the semiconductor components can be subjected to higher energization as a result of the high thermal capacity of the carrier body.