Hydrophilic hot melt adhesive
US6860961B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2002 |
| Grant date | Mar 1, 2005 |
| Priority date | — |
| Expiry date | Jun 24, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249985
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Hydrophilic hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by blending various adhesive components with a surfactant. The surfactant has a hydrophile-lipophile balance (HLB) number of less than 15, and is incorporated into the composition in an amount such that the resultant adhesive has a contact angle of 75° of less, and preferably less than about 40°. A low contact angle is desirable so that water, urine or other water-based discharges, upon contacting a laminate bound together by the adhesive, wets out rather than beads up resulting in the fluid being directed away from the adhesive and towards an absorbent core of the disposable article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.