Molding tool construction and molding method
US6861021B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2003 |
| Grant date | Mar 1, 2005 |
| Priority date | — |
| Expiry date | Aug 2, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/7393
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An molding apparatus useful for molding polymer compositions includes a substrate; a first insulating layer having an electrical resistivity of at least about 1010 ohm-centimeters and thermal conductivity of about 0.2 to about 5 watts/(meter-kelvin); a heating element; a second insulating layer having an electrical resistivity of at least about 1010 ohm-centimeters and a thermal conductivity of at least about 5 watts/(meter-kelvin); and a first molding layer having a specific heat capacity of about 100 to about 2,500 joules/(kilogram-kelvin), and optionally, a second molding layer. The apparatus provides rapid heating and cooling of the mold surface. The apparatus may be employed for rapidly molding articles having desirable surface characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.