Patent · US Expired

Thermoformable film lamination containing a flexible polyamide coextrusion

US6861125B1 · kind B1 · utility

14Cited by
12References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 18, 2001
Grant dateMar 1, 2005
Priority date
Expiry dateMay 27, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/3192
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A flexible packaging film construction which includes an outer layer of formable biaxially oriented polyester which is printed on one side and adhered to a flexible polyamide containing coextruded film.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.