Three dimensional microstructures and method of making
US6861205B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2002 |
| Grant date | Mar 1, 2005 |
| Priority date | — |
| Expiry date | Feb 6, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0159
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of forming complex three-dimensional microstructures wherein an external stimulus is applied to a first layer of a photosensitive material, thereby creating voids in the first layer, and any material present in those voids is removed. A sacrificial material is then provided within at least a portion of the voids. This sacrificial layer fills the voids, either in whole or in part, and enables a second layer of photosensitive material to be stacked upon the first, while still preserving the pattern formed in the first layer. Once the sacrificial layer has been applied, a second layer of photosensitive material may then be stacked onto the first. Successive layers of photosensitive material and sacrificial material may be added until a final, complex three-dimensional structure is created. The sacrificial material may then be removed with a solvent such as carbon dioxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.