Low stress die attachment
US6861587B1 · kind B1 · utility
7Cited by
8References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2000 |
| Grant date | Mar 1, 2005 |
| Priority date | — |
| Expiry date | Mar 15, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for resiliently attaching a mass to a package. The system includes a mass, a housing, resilient couplings for resiliently attaching the mass to the housing, bumpers for slidingly supporting the mass, and electrical connections for electrically coupling the mass to the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.