Housings for circuit cards
US6862180B2 · kind B2 · utility
12Cited by
72References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2002 |
| Grant date | Mar 1, 2005 |
| Priority date | — |
| Expiry date | May 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/063
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A housing for circuit cards is provided. The housing has a shell. A thermally conductive liner integral with the shell lines an interior of the shell. A protrusion of the liner extends through the shell and contacts the shell to form a pressure seal between the liner and the shell. A heat sink is disposed on an exterior surface of the shell and is thermally coupled to the protrusion of the liner. A case is disposed within the liner and is thermally coupled to the liner. The case is adapted to receive a plurality of circuit cards so that the plurality of circuit cards is thermally coupled to the case.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.