Volumetrically efficient electronic circuit module
US6862191B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2003 |
| Grant date | Mar 1, 2005 |
| Priority date | — |
| Expiry date | Aug 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/284
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A miniaturized microelectronic, hybrid circuit package having either a single or a multi-layer, flexible, printed circuit substrate with printed conductors interconnecting a plurality of integrated circuit (IC) dies with a ball grid array (BGA) of contacts. The IC dies are arranged on parallel strips defined between preferential fold zones formed in the substrate. The dies are over molded with plastic that is shaped to facilitate the substrate being folded to form a polyhedron. When so folded, the over molded IC dies face inward and BGA is exposed on an outwardly facing surface to facilitate attachment of the folded package to a motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.