Automated banding defect analysis and repair for document processing systems
US6862414B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2002 |
| Grant date | Mar 1, 2005 |
| Priority date | — |
| Expiry date | Aug 16, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G15/55
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Using a system of computer modules operatively associated with a document processing machine, banding defect analysis is accomplished by analyzing specific test patterns via image processing. The banding defects are characterized in terms of quantitative parameters based on an analysis of the banding defect. Key features are extracted from the banding defect parameters. The key features are analyzed in a diagnostic engine, to determine the possible source of the defect. The identified source is correlated to a recommended repair service procedure. The diagnostic process may be augmented by also including machine data in the analysis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.