Patent · US Expired

In-situ randomization and recording of wafer processing order at process tools

US6862495B2 · kind B2 · utility

5Cited by
7References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 4, 2003
Grant dateMar 1, 2005
Priority date
Expiry dateDec 4, 2023

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S414/137
  • WIPO fieldControl
  • WIPO sectorInstruments

Abstract

Wafer order is randomized in-situ by use of a separate wafer staging area and randomly shuffling wafers to and from this staging area to shuffle the processing order of the wafer lot. Positional data is captured for each wafer at both the send and receive ends of the process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.