Row slicing method in tape head fabrication
US6863061B2 · kind B2 · utility
1Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2003 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | Jan 15, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/022
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.