Optical sub-assembly packaging techniques that incorporate optical lenses

US6863450B2 · kind B2 · utility

Assignee

• NATIONAL SEMICONDUCTOR CORPORATION · US

Inventors

• William Paul Mazotti · San Martin, US
• Jia Liu · Wuxi, CN
• Luu Thanh Nguyen · San Jose, US
• Haryanto Chandra · Sunnyvale, US
• Peter Deane · Los Altos, US
• Todd Thyes · Appleton, US
• Brian Huss · Little Chute, US
• John Rukavina · Neenah, US
• Glenn Woodhouse · Pullman, US

Key dates

• Filing date: Dec 10, 2002
• Grant date: Mar 8, 2005
• Expiry date: Jan 6, 2023

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/4239
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the environment and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.