Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
US6863774B2 · kind B2 · utility
1Cited by
20References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2002 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | Oct 24, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad for use in chemical mechanical polishing of substrates that being made of fibrous matrix such as cellulose with a binder consisting of thermoset resin material, such as phenolic resin. The polishing surface is ground to form asperities. The polishing pad provides a porous structure by which polishing slurry and polishing debris during chemical mechanical polishing of substrates are stored for subsequent rinsing away, and for enhanced flow-distribution of the polishing slurry. Also disclosed is a method of making the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.