Method for producing a torsion spring

US6863832B1 · kind B1 · utility

Assignee

• LITEF GmbH · DE

Inventors

• Maik Wiemer · Limbach-Oberfrohna, DE
• Karla Hiller · Oelsnitz, DE
• Detlef Billep · Chemnitz, DE
• Uwe Breng · Gundelfingen, DE
• Bruno Rvrko · Meßkirch, DE
• Eberhard Handrich · Kirchzarten, DE

Key dates

• Filing date: Jul 20, 2000
• Grant date: Mar 8, 2005
• Expiry date: Aug 19, 2021

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2201/0133
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method for producing a silicon torsion spring capable, for example, of reading the rotation rate in a microstructured torsion spring/mass system. The system that is produced achieves a low torsional stiffness compared to a relatively high transverse stiffness in the lateral and vertical directions. The method proceeds from a wafer or wafer composite and, upon suitable mask coverage, a spring with a V-shaped cross section is formed by anisotropic wet-chemical etching which preferably extends over the entire wafer thickness and is laterally delimited only by [111] planes. Two of the wafers or wafer composites prepared in this way are rotated through 180° and joined to one another oriented mirrorsymmetrically with respect to one another, so that overall the desired X-shaped cross section is formed.