Reverse thermal gels and the use thereof for rapid prototyping
US6863859B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 15, 2002 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | Mar 10, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y10/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention relates to novel polymeric compositions that exhibit Reverse Thermal Gelation (RTG) properties for use as Support Materials (SM) in the manufacture of three-dimensional objects. These polymers are Temperature Sensitive Polymers that respond with a significant change of properties to a small change in temperature. Temperature Sensitive Polymers exhibit cloud point (CP) or lower critical solution temperature (LCST) in aqueous solutions. Water-soluble Temperature Sensitive Polymers are chosen to give low viscosity liquid at low temperature when dissolved in water and by that to permit easy dispensing at low temperature. Raising the temperature above their gelation temperature (Tgel) will result in solidification of the composition. At its gel position the material has favorable characteristics as a support and building material. The gel layers have the appropriate toughness and dimensional stability to support the model layers during the building process. After the building process is completed the gel can be cooled down to a temperature below its Tgel so the gel can liquefy and be removed easily by rinsing with water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.