Method of forming selective electroless plating on polymer surfaces
US6863936B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2001 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | Jan 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/167
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of plating an aromatic polymer substrate comprises: applying a strippable coating of a non-aromatic polymer to a substrate surface to be plated; selectively illuminating the coated substrate surface with laser light to ablate a selected area of the strippable coating and to activate an underlying region of the substrate surface exposed by the ablation of the strippable coating; contacting the substrate surface with a seeding solution containing polymer-stabilised catalytic seeding particles, so that the seeding particles adhere preferentially to the activated region of the substrate; and electrolessly plating the substrate surface, whereby the seeded areas of the substrate surface are selectively plated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.