Curable compositions
US6864317B1 · kind B1 · utility
5Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1999 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | Sep 14, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F2810/40
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a heat-curable composition gives cured phenolic resin products having excellent flexibility; the present invention relates to a heat-curable composition comprising (A) a vinyl polymer having at least one phenol group at the main-chain terminus and (B) a phenolic resin; the present invention related to a polymer obtainable by reacting (A) a vinyl polymer having at least one phenol group at the main-chain terminus with (C) an aldehyde compound, to a heat-curable composition comprising the polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.