Electronic component and package
US6864424B2 · kind B2 · utility
1Cited by
10References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 25, 2004 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | May 25, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48472
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An electronic component includes: a package that includes a metal portion formed by pressing a metal, and an insulating portion attached to the metal portion through fusing; a chip housed in the package; first external terminals that are electrically connected to the chip with metal wires, and are partially embedded in the insulating portion; and ground terminals that are convexities of metal portion and are electrically connected to the chip with metal wires, connecting points between the first external terminals and the chip being located at the same height as connecting points between the ground terminals and the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.