High precision, rapid laser hole drilling

US6864459B2 · kind B2 · utility

Assignee

• The Regents of the University of California · US

Inventors

• Jim Chang · San Leandro, US
• Herbert W. Friedman · Oakland, US
• Brian J. Comaskey · Walnut Creek, US

Key dates

• Filing date: Feb 8, 2001
• Grant date: Mar 8, 2005
• Expiry date: Aug 4, 2021

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K2103/52
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A laser system produces a first laser beam for rapidly removing the bulk of material in an area to form a ragged hole. The laser system produces a second laser beam for accurately cleaning up the ragged hole so that the final hole has dimensions of high precision.