Method of ablating an opening in a hard, non-metallic substrate
US6864460B2 · kind B2 · utility
12Cited by
37References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2002 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | Apr 12, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0029
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of ablating a hole into a hard, non-metallic substrate is disclosed. At least on laser assembly capable of generating a laser beam in an axis having a focus that is moveable relative to said axis is provided. A focus of the laser beam is positioned adjacent at least one surface of the substrate. A first layer of the substrate is ablated by the laser beam. The focus is moved relative to the axis corresponding to the depth of the substrate thereby enabling ablation of successive layers of the substrate. Successive layers of the substrate are ablated to generate a hole into the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.