Two piece heat sink and device package
US6864573B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2003 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | May 6, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A two piece electronic component heat sink and device package comprising a first piece configured to retain electronic components, and a second piece having a hinge region configured to moveably connect the second piece to the first piece, and a snap lock region opposite the hinge region, the snap lock region configured to secure the second piece to the first piece. A two piece electronic component heat sink and device package for a circuit board comprising: a first piece having an index slot for retaining said circuit board, and a second piece having a hinge region configured to pivotably connect the second piece and the first piece, and a snap lock region configured to secure the second piece to the first piece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.