Microstructure cooler and use thereof

US6865081B2 · kind B2 · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Heinrich Meyer · Berlin, DE
• Konrad Cramer · Berlin, DE
• Olaf Kurtz · Berlin, DE
• Peter Prechtl · Munich, DE
• Sven Theisen · Starnberg, DE
• Markus Hohn · Oberhaching, DE
• Ralph Herber · Mainz, DE

Key dates

• Filing date: Mar 21, 2003
• Grant date: Mar 8, 2005
• Expiry date: Aug 10, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Thermal processes and apparatus
• WIPO sector: Mechanical engineering

Abstract

The invention relates to a microstructure cooler 3 for an article 4 to be cooled, whereby the cooler 3 includes a stack of at least two metal films 1 and one base plate 5 that can be brought via a thermal contact surface 6 into thermal contact with the article 4, the metal films 1 and the base plate 5 are joined to one another in a material fit, present in the metal films 1 are channels 2 for cooling medium, and the channels 2 have a width in the range of 100 to 2,000 μm, a depth in the range of 25 to 1,000 μm, and a mean interval in the range of 50 to 1,000, residual film thicknesses resulting from the channels 2 in the metal films 1 are in the range of 50 to 300 μm, and the base plate 5 has a thickness in the range of 200 to 2,000 μm.