Method for forming an optical printed circuit board
US6865307B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2003 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | Aug 27, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
According to one embodiment of the invention, a method includes providing a printed circuit board having a plurality of optoelectronic components coupled to a first side of the printed circuit board, forming a first clad layer outwardly from the first side of the printed circuit board, coupling an injection molding mold to the first side of the printed circuit board, injecting a material into the mold in liquid form, and after the material is solidified, decoupling the injection molding mold from the first side of the printed circuit board, thereby forming an optical waveguide outwardly from the first clad layer. The method may also include forming a second clad layer outwardly from the optical waveguide, and forming a metal layer outwardly from the second clad layer. In lieu of injection molding, stamping may be performed to form the core layer of the optical waveguide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.