Method of removing optical device
US6865790B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2002 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Jan 17, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1189
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of removing an optical device contained within a device package from a circuit board, wherein the device package is secured to the circuit board using an adhesive pad. The method includes peeling a portion of the adhesive pad away from the circuit board, inserting an optical removal tool between the optical device and the circuit board, wherein the optical removal tool has a pair of fork portions and a cavity positioned between the fork portions, and the fork portions straddle one or more leads on the optical device during the inserting step, and prying the remainder of the adhesive pad away from the circuit board using the optical device removal tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.