Patent · US Expired

Preparation of heat sink materials

US6865906B1 · kind B1 · utility

4Cited by
7References
19Claims
0Family size

Assignee

Inventor

Key dates

Filing dateFeb 24, 2000
Grant dateMar 15, 2005
Priority date
Expiry dateFeb 24, 2020

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P20/10
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

Portable refrigeration devices including methods for preparing heat sink materials for use in such devices, and the heat sink materials prepared in this way. The methods relate to the encapsulation of such materials, and the maximization of heat transfer efficiency to heat sink materials in such refrigeration devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.