Sealing resin-metal assembly
US6866272B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2003 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Feb 6, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sealing resin-metal assembly includes a sealing resin layer injection molded on at least one side of a sheet metal via an elastic primer layer within a mold die. A portion of the elastic primer layer that is brought into abutment with the mold die is formed thicker than the other portion of the elastic primer layer that is not brought into abutment with the mold die so that a clamping pressure of the mole die is received by the elastic primer layer at the portion formed thicker, when the sealing resin layer is laminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.