Method of manufacturing chip inductor
US6867133B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2001 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Sep 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F27/292
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Method of manufacturing a chip inductor including the steps of, a conductive layer forming process for forming conductive layer 4 on an outer periphery 2 and end surfaces 3 of a substrate 1, a coil portion forming process for forming coil portion 7 having conductor 5 and groove 6 by cutting spirally the conductive layer 4, an etching process for etching the substrate 1 having the coil portion 7 formed thereon; an insulation resin coating process for forming outer coating 8 by coating a surface of the conductive layer 4 with insulation resin 13; and an electrode forming process for forming electrodes 9 at both ends of the coil portion 7, and for making electric contacts between electrodes 9 and the conductive layer 4. A chip inductor having a flattened mounting surface of the outer coating is obtained when insulation resin layer 8 is formed by an electrodeposition method in the insulation resin coating process. The chip inductor can be securely mounted to a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.