Photocurable and thermosetting resin composition
US6867282B2 · kind B2 · utility
6Cited by
0References
10Claims
0Family size
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Key dates
| Filing date | Jun 3, 2003 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Jun 3, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L71/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The photocurable and thermosetting resin composition of the present invention includes (A) an actinic energy ray-curable resin having at least one structure represented by the following general formula (1), (B) a photopolymerization initiator, (C) a diluent, and (D) a thermosetting component. In the general formula (1), R1 represents a hydrogen atom or an alkyl group of 1 to 6 carbon atoms, R2, R3 and R4 independently represent a hydrogen atom, an alkyl group of 1 to 6 carbon atoms, an aryl group, an aralkyl group, a cyano group, a fluorine atom, or a furyl group, and X represents a polybasic acid anhydride residue.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.