Multi-layer ceramic feedthrough structure in a transmitter optical subassembly
US6867368B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2003 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Jul 23, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/183
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A multi-layer feedthrough structure for use in optoelectronic equipment. The feedthrough structure is composed of multiple stacked ceramic layers that together form a multi-layer platform. The multi-layer platform bisects the base portion of a header assembly that is located within the transmitter optical subassembly such that an interior portion of the multi-layer platform is located within the header assembly and an exterior portion is disposed outside. Each layer contains at least a portion of a plurality of conductive pathways that extend from the exterior to the interior portion of the multi-layer platform. A top insulating layer enables the conductive pathways to pass from the exterior to the interior portion of the platform without electrically contacting the header assembly base. The conductive pathways serve as electrical interconnects between components located within the header assembly and structures outside thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.