Automated positioning of mobile laser peening head
US6867390B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2003 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Feb 21, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D7/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention enables the processing head to locate itself precisely on the surface of the structure being processed, and to then reposition itself correctly for the next laser spot. Further, the present invention will complete processing a laser peened area, the area including a multiplicity of spots arranged in a specific pattern, and correctly laser peen each spot in the area under control of a controller including control linkages with the laser.The invention further provides an automated laser peening processing head encompassing spatial position sensing and locating means, as well as programmed spatial positioning, application of overlay materials, verification of proper overlay condition and positioning, and notification of the laser to pulse the surface of the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.