Metal fuse structure for saving layout area
US6867441B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2003 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Oct 8, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fuse structure for a semiconductor device on a substrate includes a fuse having an electrically conductive fuse line of a standard fuse length formed in an electrically conductive layer disposed over the substrate, and a pair of electrically conductive, inwardly bent interconnects formed in a first plurality of electrically conductive layers disposed over the substrate, below the electrically conductive layer in which the fuse line is formed. The inwardly bent interconnects couple the fuse line to a circuit area of the substrate disposed under the fuse line. The fuse structure may further include a protective guard ring formed around the fuse. The guard ring includes a second plurality of electrically conductive interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.