Method and apparatus for printed circuit board pads with registering feature for component leads
US6867504B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2003 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Jul 7, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for printed circuit board pads with registering feature for component leads. A U-shaped metalized pad is disposed on a printed circuit board for soldering to a component lead. Solder is disposed on the pad and heated to a molten state so that surface tension and wetting effects form the molten solder into a solder mound having a U-shaped lateral cross section conforming to the U-shaped metalized pad. The solder mound has a first arm and a second arm, and a lateral aperture extending therebetween for receiving an extremity of the component lead, and registering the extremity of the component lead with respect to the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.