Semiconductor device, a method for making the same, and an LCD monitor comprising the same
US6867505B2 · kind B2 · utility
11Cited by
4References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2001 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Dec 3, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device, comprising an electrode on a base surface, a bump formed on the electrode, a pad, and a means of connection. The means of connection comprises a plurality of conductive particles, conducting the bump and the pad with conductive particles bonded between. The base surface is further formed with a barrier rib that separates the conductive particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.