High frequency signal transmission from the surface of a circuit substrate to a flexible interconnect cable
US6867668B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2002 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Apr 21, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure, a microstrip structure, a stripline structure, or the like. The cable can be coupled to destination components using a variety of connection techniques, e.g., direct bonding to a circuit substrate, direct soldering to a flip chip, mechanical attachment to a component, or integration with a circuit substrate. The cable can also be terminated with any number of known or standardized connector packages, e.g., SMA, GPPO, or V connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.