Patent · US Expired

Vibration sensor for fixing directly or indirectly to a vibrating component

US6868714B2 · kind B2 · utility

4Cited by
8References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 30, 2001
Grant dateMar 22, 2005
Priority date
Expiry dateDec 25, 2021

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01N2291/02872
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A vibration sensor for direct or indirect mounting on a vibrating component has a housing, a pressure sleeve having a central bore and a piezoelectric disk situated between two insulator disks and two contact disks, a seismic mass acting on the disks by way of a spring element. The spring element is designed with a ring shape and has a projection on its inside ring area. On the outside circumference of the pressure sleeve there is a recess which is designed to correspond to the projection and is formed to accommodate the projection on the spring element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.