Vibration sensor for fixing directly or indirectly to a vibrating component
US6868714B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2001 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | Dec 25, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/02872
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A vibration sensor for direct or indirect mounting on a vibrating component has a housing, a pressure sleeve having a central bore and a piezoelectric disk situated between two insulator disks and two contact disks, a seismic mass acting on the disks by way of a spring element. The spring element is designed with a ring shape and has a projection on its inside ring area. On the outside circumference of the pressure sleeve there is a recess which is designed to correspond to the projection and is formed to accommodate the projection on the spring element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.