Polishing pads and methods relating thereto
US6869350B2 · kind B2 · utility
29Cited by
13References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2003 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | Sep 27, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.