Multi-level stamper for improved thermal imprint lithography
US6869557B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2002 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | Apr 20, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A stamper/imprinter for use in performing thermal imprint lithography of a substrate/workpiece surface to form a pattern of features in first portions of the surface intended to receive the pattern, without incurring random formation of undesired, disordered features in second portions of the substrate/workpiece surface not intended to receive the pattern, comprising an imprinting surface configured to substantially prevent formation of gaps between the imprinting surface and the second portions of the surface during stamping/imprinting. Embodiments include stampers/imprinters with a multilevel imprinting surface comprises a first portion having a first level for forming the pattern of features in the first portions of the surface and a second portion having a second level for substantially preventing formation of gaps between the imprinting surface and the second portions of the surface during stamping/imprinting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.