Material and method for three-dimensional modeling
US6869559B2 · kind B2 · utility
96Cited by
5References
43Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 5, 2003 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | Jul 17, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2081/06
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention is a modeling technique wherein a three-dimensional model and its support structure are built by fused deposition modeling, using a thermoplastic blended material containing a polyphenylsulfone (PPSF) polymer and a polycarbonate (PC) polymer to form the model. The PPSF/PC blend exhibits good chemical resistance, thermal stability, and resists build-up in the nozzle of a three-dimensional modeling apparatus. Removal of the support structure from a completed model is facilitated by operating on the material while it is hot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.