Method of processing light-sensitive material

US6869743B1 · kind B1 · utility

Assignee

• MITSUBISHI PAPER MILLS LIMITED · JP

Inventors

• Shigeyoshi Suzuki · Nagaokakyo, JP
• Yasuo Tsubai · Nagaokakyo, JP
• Sadao Kuriu · Tokyo, JP
• Toshihito Maruyama · Tokyo, JP
• Kenji Hirata · Niigata, JP
• Masato Asano · Kasai, JP
• Masahiko Saikawa · Tokyo, JP
• Akira Furukawa · Kariya, JP

Key dates

• Filing date: Nov 15, 2000
• Grant date: Mar 22, 2005
• Expiry date: May 18, 2021

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/346
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

There is disclosed a method of processing a light-sensitive material which comprises exposing a light-sensitive material having at least one light-sensitive layer on a support, and subjecting to development by a dipping system or a coating system, and then, peeling at least the light-sensitive layer off by bringing a peeling material into close contact with the light-sensitive material, wherein the peeling material is a material having a liquid-absorbing rate in which a liquid-absorption amount within 0.1 second after getting in contact with a liquid is 60% or more based on a liquid-absorption amount within 0.2 second after the same.