Method and device for cutting a flat glass plate into a number of rectangular plates
US6870129B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2001 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | Aug 1, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/304
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The cutting of the flat glass plate (1) into rectangular plates with a predetermined edge length is performed by forming initial cracks at the beginning of cutting lines on the glass plate and moving a laser beam along the cutting lines followed by a cooling spot to induce a thermo-mechanical stress alone the cutting lines. First the glass plate (1) is cut apart into partial plates (2-5) along first parallel cutting lines spaced according to the predetermined edge length. Then the cut apart glass plate is rotated by 90° and the partial plates (2-5) are moved apart from each other. Subsequently the partial plates that have been moved apart are cut apart alone several parallel second cuts (4-9) perpendicular to the first cuts. This method facilitates exact placement of the initial cracks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.