Patent · US Expired

Method and device for cutting a flat glass plate into a number of rectangular plates

US6870129B2 · kind B2 · utility

9Cited by
7References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 20, 2001
Grant dateMar 22, 2005
Priority date
Expiry dateAug 1, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T225/304
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

The cutting of the flat glass plate (1) into rectangular plates with a predetermined edge length is performed by forming initial cracks at the beginning of cutting lines on the glass plate and moving a laser beam along the cutting lines followed by a cooling spot to induce a thermo-mechanical stress alone the cutting lines. First the glass plate (1) is cut apart into partial plates (2-5) along first parallel cutting lines spaced according to the predetermined edge length. Then the cut apart glass plate is rotated by 90° and the partial plates (2-5) are moved apart from each other. Subsequently the partial plates that have been moved apart are cut apart alone several parallel second cuts (4-9) perpendicular to the first cuts. This method facilitates exact placement of the initial cracks.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.