Method and apparatus for providing an integrated circuit cover
US6870246B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2001 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | Aug 31, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit cover incorporating a spring portion is described. The spring portion may include any structure that allows displacement between a plate portion of the integrated circuit cover and an attachment portion of the integrated circuit cover and that provides a substantially equalizing effect of pressure on the plate portion. The spring portion is preferably more flexible than the plate portion. The integrated circuit cover accommodates variations in the mounted height of integrated circuits over which the integrated circuit cover is installed The integrated circuit cover may be formed as a unitary structure or may be constructed as an assembly of multiple components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.