Heat sink with visible logo
US6870735B2 · kind B2 · utility
6Cited by
17References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2003 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | May 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink is for an element to be cooled has a thermally conductive base and a plurality of thermally conductive pins or fins extending substantially perpendicular from the base, said pins or fins being arranged in a predetermined pattern. The pins at least partially frame thermally conductive projections extending substantially perpendicular from said base which forming a discernable logo having an upper surface and sides for providing plural cooling surfaces. In this instance the 3-D logo performs cooling of the components within a package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.